Add flash memory to automotive analogue devices

3rd February 2016

Source:

Renesas

Posted By : Nat Bowers

Renesas Electronics has announced the development of 90nm one-transistor MONOS (Metal-Oxide-Nitride-Oxide-Silicon) flash memory technology that can be used in combination with a variety of processes, such as CMOS and bipolar CMOS DMOS (BiCDMOS), and provides high Programme/Erase (P/E) endurance and low rewrite energy consumption.

Renesas anticipates that the flash memory circuit technology will enable it to add flash memory to automotive analogue devices with improved performance and reliability. This superior circuit technology enables the industry’s first P/E endurance of over 100m cycles under a high junction temperature of 175°C, while also delivering low rewrite energy of 0.07mJ/8kB for low energy consumption.

One-transistor memory cells that allow the mixing of processes with fewer additional mask layers require application of a positive voltage to the memory cell selection gate during read operations. Also, a thinner charge-trapping film is necessary in order to achieve energy-efficient Fowler-Nordheim (FN) tunnelling during P/E operations. Both of these are factors that tend to reduce reliability under the high temperature conditions typical of automotive applications. To address this issue, Renesas has combined the one-transistor flash memory technology with the newly-developed array architecture technology that eliminates the need to apply a positive voltage during read operations to prevent reduction reliability under high-temperature conditions and assures the quality essential in automotive products. In addition, the newly developed one-transistor flash memory technology enables reduced power consumption during P/E operations.

As the performance of automotive analogue devices improves and the trend toward single-chip integration with MCUs continues, and the scope of applications expands from analog circuit tuning to include auto-fitting or data logging functionality, market demand for flash memory with greater P/E endurance is expected to increase. A newly developed Adaptable Slope Pulse Control (ASPC) technology enables generation of smoother rewrite pulses as a way to weaken electric fields that can degrade the characteristics of memory cells, boosting P/E endurance to over 100m cycles. The newly developed technology uses ASPC when applying rewrite pulses, monitoring the current value when pulses are applied and switching automatically to the optimal clock frequency. This lowers current consumption during P/E operations to a mere 98µA, which translates into a rewrite energy of 0.07mJ/8kB.

The newly developed Idling Programme Erase Management Unit (IPEMU) function enables the flash memory to control rewrites itself when the vehicle’s engine is stopped by a start-stop (anti-idling) system. This makes it possible to terminate the CPU and SRAM that activates the flash control and reduces power consumption during idle state by 99%.

By adopting these technologies, Renesas has developed 128kB flash memory prototypes employing 90nm one-transistor MONOS flash memory that successfully achieved the industry’s first P/E endurance over 100m cycles with a low rewrite current of 98µA. This rewrite current is two orders of magnitude smaller than previously achieved and translates into a rewrite energy of 0.07mJ/8kB.

The ability to easily add flash memory to devices employing a variety of processes, combined with low power consumption, is expected to also expand the range of possible IoT applications.

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SQI Flash devices operate over extended-voltage range

8th February 2016

Source:

Microchip Technology Ltd

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Datasheet

Posted By : Nat Bowers

SQI Flash devices operate over extended-voltage range

Featuring an extended voltage and larger temperature range, Microchip has announced a family of automotive-grade NOR Flash products. The SST26VF family is available in 16, 32 and 64Mb densities and operates at Automotive Grade 2 and 3, extending the operating voltage from 2.7 down to 2.3V and temperature up to +105°C.

The SST26VF offers numerous features and benefits achieved with SST’s proprietary, high-performance SuperFlash technology, which significantly improves reliability and performance, including the industry’s fastest erase times, whilst reducing power consumption for high-bandwidth, compact designs. The SST26VF family consumes 15mA in typical high-speed operating conditions, which benefits automotive applications working to meet growing energy-saving requirements.

The robustness of the SuperFlash technology memory cell brings high endurance to rewrite cycling and excellent data retention with extremely low failure rate and good performance at high temperatures. All of these features are critical parameters to meet the vigorous requirements for automotive quality and reliability. The product also supports the long life cycle required by the automotive industry.

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Polymer chip capacitors meet challenging 125°C lifetime stability test

11th February 2016

Source:

AVX

Posted By : Jordan Mulcare

Polymer chip capacitors meet challenging 125°C lifetime stability test

AVX Corporation has introduced the robust TCQ Series automotive conductive polymer chip capacitors. Qualified to the Automotive Electronics Council’s AEC-Q200 specification for passive components, the TCQ Series meets the AEC’s challenging 125°C lifetime stability test and humidity bias testing at 85°C and 85% relative humidity for up to 1,000 hours.

“The AEC-Q200 lifetime stability and humidity bias tests are notoriously difficult for polymer capacitors to pass due to inherent material limitations. As such, we based our new TCQ Series automotive conductive polymer chip capacitors on our proven, high reliability TCR Series professional conductive polymer chip capacitors, making several critical improvements to the material, design, and manufacturing processes in order to deliver the enhanced endurance and high stability, harsh environment performance required to achieve AEC-Q200 qualification,” said Gordon Hoey, global automotive product marketing manager, AVX.

TCQ Series automotive conductive polymer chip capacitors feature conductive polymer electrodes, which enable a benign failure mode under recommended use conditions, and exhibit basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 60% confidence. The series also delivers low DC leakage (0.1CV), high capacitance and stable electrical performance at operating temperatures as high as 125°C in small, low profile case sizes, which makes them suitable solutions for a wide variety of space-constrained, harsh environment automotive, industrial, telecommunications and DC/DC converter applications.

Lead-free compatible and RoHS compliant, the new TCQ Series automotive conductive polymer chip capacitors are currently available in three case sizes: 1210 (EIA Metric 3528-21), 2917 (EIA Metric 7343-31) and 2917 (EIA Metric 7343-20). The full voltage range for the series spans 4 to 35V, and capacitance values span 4.7 to 220μF with a ±20% capacitance tolerance.

TCQ Series capacitors are also three times reflow compatible at 260°C and are rated for operating temperatures ranging from -55 to +125°C,. Manufactured at an ISO/TS 16949 certified plant in accordance with the Automotive Electronics Council’s AEC-Q200 specification for passive components, TCQ Series capacitors are supplied with 100% tin terminations on 7 or 13” reels, and lead time for the series is 10–12 weeks.

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Automotive SoCs specialised for 3D graphics clusters

16th February 2016

Source:

Renesas

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Posted By : Nat Bowers

Automotive SoCs specialised for 3D graphics clusters

Renesas Electronics has announced the R-Car D1 Series, the first SoC in the R-Car family specialised for 3D instrument cluster systems. As more automotive systems are expected to shift to 3D graphics instrument cluster systems in the near future, Renesas has introduced this series to provide a smooth migration path for automotive system manufacturers.

As the use of colour LCD panels in instrument cluster systems becomes more widespread, gauge control and graphics display are being combined even in smaller and medium size cars. The trend towards ‘gauge-less’ displays is already progressing in high-end cars, where visibility and comfort are desired and attractive, easy to see displays using 3D graphics on large, high-resolution panels are seen as one aspect of a car’s individuality. In the future, display size and resolution are expected to continue increasing, even in the graphics displays used in low- to mid-end cars, along with the use of cluster systems that provide 3D graphics similar to that used in high-end cars.

However, for these systems to become more mainstream the ability to realise rich reality image display that makes full use of 3D graphics, the ability to display the cluster screen rapidly at the same time as the start-up of accessories, the ability to realise high reliability that can prevent unauthorised access from the outside to the system to continuously convey accurate information of the instruments to the driver and the ability to enhance the performance of the many electronic equipment units and communications systems used in the car will all be required.

The R-Car D1 provides both the functionality and the performance to overcome these issues and furthermore, since Renesas users can take advantage of the R-Car Consortium ecosystem that consists of over 170 companies, they will be able to develop 3D graphics cluster systems quickly. Renesas will promote the more widespread use of 3D graphics.

Instrument cluster systems require a rapid startup so that, for instance, immediately after the driver opens the driver’s side door, or at the same time accessories are starting up, the system can instantly display the screen or output audio run at high speed. Renesas, along with their partner companies participating in the R-Car ecosystem, provides solutions that support high-speed system startup, rapid display of meter and gauge screens and audio output.

Since instrument cluster systems may cause serious accidents should they malfunction, it is desired that, to provide the driver with correct information, these systems continuously monitor whether or not correct information is being output and, should a malfunction occur in the system, the malfunction needs to be immediately detected. To implement high-reliability systems, R-Car D1 supports the ISO 26262 standard for automotive functional safety. Renesas provides a Functional Safety Support Program to implement functionally safe systems.

Furthermore, since it is necessary to prevent hacking from outside the system to implement safe and secure systems, the RH850 32-bit MCU that includes hardware security functions can be combined with the R-Car D1. This makes it possible to construct systems that assure data robustness and prevent hacking.

The R-Car D1 includes the wide variety of communications interfaces required in an instrument cluster system. Since the R-Car D1 supports this range, including Ethernet AVB for connection with navigation systems, USB to connect with smart phones, and CAN-FD to connect with automotive infotainment systems, it supports superlative system flexibility and ease of design.

The RH850/D1M MCUs can implement both gauge control and 2D graphics display with a single chip and is already used in a wide range of cars. Since the R-Car D1 SoC includes the same 2D graphics system as that used in the RH850/D1M, system manufacturers can make use of these 2D graphics development assets and develop 3D graphics systems for the R-Car D1. Also, if gauge control is required, system manufacturers can also combine the R-Car D1 with the RH850/D1M to implement such systems.

Samples of the R-Car D1 series are available now. Mass production is scheduled to begin in March 2017 and is expected to reach a volume of 100,000 units per month by March 2018.

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Power Metal Strip resistor increases accuracy & reduces TCR

17th February 2016

Source:

Vishay

Whitepapers

Datasheet

Posted By : Nat Bowers

Power Metal Strip resistor increases accuracy & reduces TCR

Combining an extended power rating to 0.5W with a Kelvin 4-terminal connection, Vishay Intertechnology has announced a surface-mount Power Metal Strip current sense resistor in the compact 1206 case size. The WSK1206…18 High Power reduces TCR down to 35ppm, enables tight tolerances down to 0.1% for increased measurement accuracy and offers low resistance values down to 0.01Ω to minimise excess power dissipation.

Offering twice the power of standard resistors in the 1206 footprint, the WSK1206…18 High Power allows designers to save board space and reduce costs by utilising fewer and smaller components. With its 4-terminal construction, the resistor reduces system errors while eliminating the need for system calibration during manufacturing or in the field to further reduce costs and improve end product performance.

The advanced construction of thecurrent sense resistor incorporates a solid metal nickel-chrome or manganese-copper resistive element with low TCR (under 20ppm/°C). This results in a pulse-tolerant, tight-tolerance resistor in the 1206 package size that maintains the superior electrical characteristics of the Power Metal Strip construction.

The WSK1206…18 High Power is suited for all types of current sensing, voltage division and pulse applications in power management for cell phones; DC/DC converters for servers, VRMs for laptops and Li-ion battery safety and management; industrial instrumentation; and automotive electronic control such as engine, transmission, anti-lock brakes, audio and climate controls.

Like all Power Metal Strip resistors, the device features an all-welded construction that contributes to its superior electrical performance. A proprietary processing technique produces extremely low resistance values ranging from 0.01 to 0.05Ω, with tight tolerances of 0.1, 0.5 and 1.0%. The WSK1206…18 High Power provides low thermal EMF (less than 3μV/°C) and operates over a temperature range from -65 to +170°C. The device is RoHS-compliant, halogen-free and Vishay Green.

Samples and production quantities of the new resistor are available now, with a lead time of six to eight weeks for larger orders.

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Automotive grade MLCCs operate at up to +200°C

18th February 2016

Source:

Murata Electronics (UK) Ltd.

Whitepapers

Datasheet

Posted By : Nat Bowers

Automotive grade MLCCs operate at up to +200°C

Designed for automotive applications, the GCB series MLCCs have been unveiled by Murata. The use of electronic components in automobiles continues to rise, particularly inside engine compartments, powertrains & safety devices. These are typically exposed to demanding environments and must have not only high levels of reliability but be able to function at high temperatures too.

Murata’s GCB series of MLCCs meet this requirementwith a maximum operating temperature of 200°C. they are also capable of being bonded and mounted using the conductive adhesives commonly used to meet the demands of an automotive environment.

The GCB series features a capacitance range of 1,000pF to 0.47μF in 0402 and 0603 sizes. They have operating temperature ranges from -55 to +150°C (X8R) or -55 to +200°C (X9M) and have a working voltage of 10 to 100VDC.

The capacitors feature newly developed electrodes made of nickel and palladium. These produce a high bonding reliability with conductive adhesives even during use in high-temperature environments. Furthermore, the terminal electrodes of the capacitors have a superior corrosion resistance compared with our previous and existing products.

The GCB series satisfies the AEC-Q200 stress test qualifications for passive components and will enter mass production in 2016.

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Automotive MCUs enhance safety of smarter vehicles

24th February 2016

Source:

STMicroelectronics

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Posted By : Jordan Mulcare

Automotive MCUs enhance safety of smarter vehicles

STMicroelectronics has introduced the first microprocessors in the SPC57 family that break new ground in automotive applications by offering the ‘industry’s best’ combination of safety assurance and cost/performance. Building on the successful 32-bit Power Architecture SPC5 microprocessor platform, the product family targets cost-sensitive automotive systems that must meet the most stringent safety requirements, up to the highest ISO26262 ASIL-D Automotive Safety Integrity Level.

The MCUs are SoC devices designed to meet the challenges of entry-level vehicle safety-critical applications, including airbags, ABS (Anti-lock Braking Systems) in cars and motorcycles, power steering and DC/DC converters/inverters for Hybrid/Electric Vehicles.

As the world increasingly embraces smarter cars, makers are meeting the challenge to ensure that all the key functions are protected against random failures, such as those caused by a single cosmic ray changing a bit in a memory cell. ST’s SPC57 devices are specifically designed to address this challenge, providing highly competitive solutions for controlling vehicle functions such as steering and braking while offering safety compliance to the highest level combined with low-cost development paths.

“Safety is a key driver of developments in the automotive industry and therefore also of the underlying semiconductor technology that is making cars safer and greener,” said Luca Rodeschini, Director Strategic Business Development and Microcontroller Business Unit, Automotive and Discrete Product Group, STMicroelectronics. “The SPC57 is a scalable, future-proof solution that combines optimal cost/performance with full compliance to the most demanding safety-assurance criteria, a long-term product-longevity commitment to customers and a comprehensive low-cost development ecosystem.”

The SPC57 family is built using the world’s most advanced 55nm automotive technology with clock speeds up to 80MHz. As important, it is supported by a full-featured, low-cost tool chain that is compatible with the existing development infrastructure of current Power Architecture devices, enabling rapid development of cost-effective, safety-critical automotive systems. The design ecosystem includes the free SPC5Studio development environment, open-source code compilers, and a range of evaluation boards that start from as low as $100.

The first four members of the SPC57 family are the SPC570S50E1 (512K Flash memory in a QFP64 package), SPC570S50E3 (512K in QFP100), SPC570S40E1 (256K in QFP64), and SPC570S40E3 (256K in QFP100), with the exposed-pad QFP packages supporting increased user pin-out functionality and thermally demanding applications. The QFP64 devices are available now, with the QFP100 devices scheduled for the end of Q1 2016.

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Automotive grade PIN photodiodes deliver photoresponse linearity

1st March 2016

Source:

Vishay

Whitepapers

Datasheet

Posted By : Jordan Mulcare

Automotive grade PIN photodiodes deliver photoresponse linearity

Vishay Intertechnology is broadening its optoelectronics portfolio with the introduction of six Automotive Grade, high-speed silicon PIN photodiodes that feature excellent photoresponse linearity for small signal detection.

Available in three low-profile, surface-mount packages, devices in the Vishay Semiconductors VEMDxx60X01 family offer fast response times; sensitive areas of 0.23, 0.85 and 7.5mm²; and high reverse light current to 38µA for automotive and industrial applications.

The AEC-Q101-qualified photodiodes released today deliver excellent linearity down to the lowest signal levels without disruptions from ambient light noise. The linearity deviation of the reverse light current is less than 1%, comparing the relative difference of the photocurrent generated by a small infrared signal (1 mW/cm²) with and without the presence of large background illumination (100 mW/cm²). This excellent linearity makes it particularly easy to design robust and reliable reflective sensors as used in touchless faucets, optical switches, proximity sensors, or automotive rain sensors.

For the detection of visible and near infrared radiation, the VEMD1060X01, VEMD5060X01 and VEMD6060X01 are clear devices with a wide sensitivity range of 380 to 1070nm. For 700 to 1070nm infrared applications, the VEMD1160X01, VEMD5160X01 and VEMD6160X01 are black devices featuring a daylight blocking filter.

The VEMDxx60X01 family is available in the 2×1.25×0.85mm top-view 0805 package; the 5x4x0.9mm top-view QFN; and the 4x2x1.05mm 1206. The devices feature ± 65° and ± 70° angles of half sensitivity, a wide temperature range of -40 to +110 °C, and wavelength of peak sensitivity of 820 or 840nm. RoHS-compliant, halogen-free and Vishay Green, the PIN photodiodes provide moisture sensitivity levels (MSL) to 3, in accordance with J-STD-020, for a floor life of 168 hours.

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Robust flash storage suits automotive & IIoT markets

1st March 2016

Source:

SanDisk

Posted By : Nat Bowers

Robust flash storage suits automotive & IIoT markets

Expanding the company’s robust, intelligent solutions designed to address the vast data generated by connected applications in automotive and industrial markets, SanDisk has introduced its latest gen automotive flash storage solution, an automotive grade SD card optimised to meet the unique storage demands of the ‘connected car’.

The new card includes a suite of built-in smart features that enhance reliability and allow OEMs to better manage storage in data-intensive automotive environments. SanDisk is also bringing these OEM-optimised features to its Industrial and Industrial XT SD cards.

Oded Sagee, Senior Director, Connected Solutions, SanDisk, commented: “The IoT is the most dynamic force to impact the automotive and industrial markets in a decade, driving exciting new opportunities for connectivity as well as new challenges for how to store, process and manage the data it creates. Our newest SanDisk Automotive and SanDisk Industrial flash storage solutions are ideal for connected applications in these markets, offering exceptional dependability and performance as well as new smart features that enable our OEM customers to better maximise their storage.”

Trusted storage for the connected car

SanDisk’s newest AEC-Q100 certified SanDisk Automotive SD card enables OEMs to bring intelligent, reliable and high-capacity data storage to a wide array of advanced, in-vehicle applications and systems, such as 3D and HD navigation and mapping systems, data event recorders, ADAS, telematics and more. The automotive grade SD card is built to meet the intense reliability, quality and temperature demands of the automotive market.

The SD card offers a new suite of smart features. These include enhanced power failure protection, a memory health status monitor, OEM customisation capabilities and enhancements for read-intensive applications, such as navigation. With these features, automotive manufacturers can designate and programme a SanDisk Automotive SD card for use exclusively with a specific connected application. Manufacturers can also remotely and proactively monitor the easily removable SD card to ensure that it is operating at its ideal performance level or to identify when card upgrades or replacements are needed.

“Cardwave works extensively with automotive customers, offering solutions for the ever-growing needs of the connected car.The automotive grade solutions from SanDiskprovide Cardwavecustomerswith innovative, cost-effective and robustflash storageto meet thedemands for the next generationofconnected carapplications andsub-systems,” said Paul Norbury, Chief Executive Officer, Cardwave.

Optimised solutions for connected industrial applications

SanDisk’s new smart features will be available in SanDisk Industrial and SanDisk Industrial XT SD card solutions. These industrial-grade cards are intended for use by OEMs in market segments that demand high endurance and reliability even in extreme temperatures, including factory applications, industrial computing, utilities, medical equipment, robotics, point-of-sale solutions, large-scale printing and many other applications. The inclusion of the new features enables OEMs to better manage the intensive data demands of a variety of applications in the industrial market, from commercial drones to industrial gateway systems to security cameras and more.

Samples of SanDisk Automotive, SanDisk Industrial and SanDisk Industrial XT SD card solutions with the new smart features will be available in March in the United States and Europe, in capacities up to 64GB.

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Rugged in-vehicle digital signage system features DC power input

8th March 2016

Source:

IBASE Technology Inc

Posted By : Jordan Mulcare

Rugged in-vehicle digital signage system features DC power input

IBASE Technology has announced the SE-602-N designed as an outdoor and in-vehicle digital signage system with a wide range DC power input of 7 to 36V. Based on 5th Generation Intel Core processors, the SE-602-N is built to withstand continuous vibration and wide operating temperature range of -40 to 75°C that makes it suitable for outdoor and automotive signage applications.

“Featuring rounded edge corners and an aluminum backbone frame that works not only as a heat sink but also airflow divider and EMI shield, SE-602-N is built around aesthetics as well as reliability,” said James Wu, IBASE’s company president. This all solid-state-design platform supports advanced power management functions including ignition sensing startup, shutdown delay and low power protection setting. The unit also has two DDR3L SO-DIMM sockets, two Gigabit Ethernets, four USB 3.0 ports and a mini PCI-E(x1) expansion slot.

SE-602-N is currently available in two models that integrate and Intel Core i7-5650U and i5-5350U. Both come with 8GB of system memory and 64GB wide-temp SSD storage. Options comprise of 80 and 60W wide temp power adapters with AC/DC 24V output.

SE-602-N Features:

  • Supports power management (ignition sensing startup, shutdown delay and low power protection setting) function
  • Supports 5th Gen. Intel Core i7/i5 ULT Processors with integrated Intel HD graphics engine
  • AMT for remote management
  • 2x M2(NGFF) and 1x Mini PCI-E(x1) slots for optional SSD storage devices, Wi-Fi, Bluetooth, 3G/LTE or TV tuner
  • 7V~36V DC wide-range power input
  • Wide operating temperature from -40 to 75°C
  • High-voltage reverse protection
  • Surge protection (Maximum: 80V)
  • e-Mark certified
  • Ruggedised, fanless and all solid state design

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